Seeking Smart Sensing Technologies for Smart Home and Appliances - Haier's Techlink Challenge
Deadline : 2020-10-31
Haier's Techlink Challenge is aimed to identify European and Israeli companies with Smart Sensing Technologies relevant for Smart Home and Appliances. The most relevant applications will be reviewed and evaluated by Haier's experts team from the global R&D centers. The best 10 applications will receive fully sponsored visits* (travel and accommodation expenses will be paid by Haier) to Haier’s global headquarters in Qingdao, China, where they will have the opportunity to meet their counterparts at Haier’s global product lines. The visit will take place during Haier’s annual Global R&D Summit in March 2021.