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CHALLENGE: Seeking: dielectric ink-jettable solder mask to cure in place using uv

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Engineering&tecnologicalsciences
Challenge ID >> C-00222
Industrial sector >> Aerospace & defence, Communications, Electronics
Country >> United States US
Budget >> Not available
Deadline >> 2010-08-12
Proposals received >> 4
Tags >> solder mask, inkjet

Company profile

Technology broker working on behalf of large multinational client





Challenge: Seeking: dielectric ink-jettable solder mask to cure in place using uv

We are seeking a solder mask that we can print using ink-jet technology.

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