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CHALLENGE: Printed electronics technologies that enable thicker, higher-viscosity circuitry, good adhesion, etc

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Engineering&tecnologicalsciences
Challenge ID >> C-00221
Industrial sector >> Aerospace & defence, Electronics
Country >> United States US
Budget >> Not available
Deadline >> 2010-08-12
Proposals received >> 0
Tags >> printing electronics technology

Company profile

Technology broker working on behalf of large multinational client





Challenge: Printed electronics technologies that enable thicker, higher-viscosity circuitry, good adhesion, etc

This organization seeks printing technology to produce higher-current miniature circuitry. approaches of interest include reducing use of expensive inks, eliminating a plating step, and increasing adhesion to a variety of substrates. an additional area of interest is to enable multilayer structures for more complex circuitry.

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